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              0.007 in./in. Even at a mold temperature of 121 C the   Figure 3 provides an  expanded view of this  transition,
              change will be 0.002 in./in. But it is apparent that the   plotting a more complete set of viscoelastic properties
              higher mold temperature minimizes dimensional changes   to highlight the area of importance. In particular, the
              that may occur due to solid-state crystallization.    property known as the loss modulus, which exhibits a peak
                                                                    associated with important transitions, shows a maximum
              As the nominal wall becomes thinner, this effect is
              magnified. By the time we reach the thinnest wall of 0.8   just below 95 C. The related tan delta peak occurs at 123
              mm, the dimensional change for a part molded at 38 C   C (253 F). This places us squarely in the recommended
              and then exposed to 100 C has doubled to 0.014 in./in.,   range of mold temperatures for producing dimensionally
              while the 3.2-mm-thick part using a mold temperature   stable POM parts.
              of 121 C reduces this change to 0.004 in./in. This is due
              to the faster cooling rate of the thin wall. Plastics are
              relatively poor conductors of heat. In the thicker wall, the
              core sections are farther from the molding surface and are
              insulated by the frozen layer that forms. This reduces the
              cooling rate and increases the degree of crystallization
              that can occur.
              It is quite clear from these data that a mold temperature
              far above the glass-transition temperature is needed to
              establish a stable crystalline structure in this material. And
              yet very little is said about the fact that the behavior of
              POM does not follow this rule, nor is there any discussion
              about the reason for this departure from what is otherwise
              a reliable  guideline for  achieving optimal levels of
              crystallinity in semi-crystalline polymers. However, if we
              closely examine the temperature-dependent behavior of   The importance of paying attention to the advice from the
              POM, we may find a clue as to the reason for this unusual   material suppliers on this matter is not to be taken lightly
              behavior.                                             and it can be easily demonstrated by simply measuring
                                                                    dimensions on a molded part, placing the parts in an
              Figure 2 shows plots of elastic modulus vs. temperature for   oven at an elevated temperature that may be related
              three different samples of POM. The scans begin at -125 C   to the application environment, and then re-measuring
              (-193 F) so that the glass transition can be observed. The   the dimensions after the parts have been removed from
              large decline in modulus that concludes at approximately   the oven and  cooled  back to  room  temperature. The
              -70 C (-94 F) is due to the glass transition of the polymer.   more stable the structure in the polymer, the smaller the
              A close examination of these curves also shows a much   dimensional change of the molded part will be and the
              smaller step transition in these samples that occurs near   more likely it is to perform as expected. Large dimensional
              80 C.                                                 changes indicate that the molding process has failed to
                                                                    achieve the desired structure.
                                                                    Some years ago, I worked with a client who was molding
                                                                    assemblies that involved two POM homopolymer parts
                                                                    that were in relative motion during operation. The mold
                                                                    temperature being used was 60 C (140 F) and the parts
                                                                    performed satisfactorily as molded. However, the end
                                                                    user knew that the parts might be exposed to application
                                                                    temperatures as high as 85 C (185 F).

                                                                    Therefore, they tested the assemblies by heating them
                                                                    to 85 C for eight hours. They then cooled them back to
                                                                    room  temperature  and  re-tested  the  assemblies. After



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