Page 31 - Plastics News October 2020
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some crosslinked materials, an additional problem that
         can  arise  is  blistering  of  the  part.  This  is  caused  by
         volatile byproducts that are naturally produced during
         condensation polymerization reactions. In the case of
         post-baking phenolic, the compound that is given off is
         ammonia. If the ammonia cannot diffuse rapidly enough
         through the wall of the part, it will produce a distortion
         in the part.
         The time required for post-baking will depend upon the
         objective.  Unlike  the  process  of  annealing  semi-
         crystalline  thermoplastics,  one  of  the  important
         consequences of post-baking a crosslinked material is an
         increase in the Tg. This increase is dependent upon both
         time  and  temperature,  and  the  relationship  is  non-
         linear. So, it is important to understand the material, the
         state it is in when it comes out of the mold, and the
         performance needed for the application. Another key     mold temperature and the Tg of the polymer in the part.
                                                                 It  should  be  obvious  that  with  a  higher  mold
         difference between annealing in the crystals in a semi-
                                                                 temperature, there will be less work to do in post-baking
         crystalline polymer and increasing the crosslink density   to achieve the desired level of performance.
         of  thermoset  polymers  is  that  in  semi-crystalline
         thermoplastics the annealing temperature must exceed    In our next column we will review annealing practices in
         the Tg of the polymer. This is not necessarily the case in   thermoplastic polyurethanes, where some remarkable
         thermosets. A phenolic resin with an as-molded Tg of 175   benefits can be achieved in a relatively short period of
         C can be post-baked at 160 C and the Tg will increase.  time.





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                                                                             Directory 2020



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         Figure 1 shows the relationship between time and the       with your details in the Directory on a
         rise in Tg in a phenolic material, from work done by Ted
         Morrison at Plenco. This shows that an increase in Tg of            complimentary basis.
         approximately 30° C can be attained in about 18 hr of
         post-baking.  But  an  additional  increase  of  the  same   Kindly send your updated contact
         magnitude  will  require  146  hr  following  the  model
         established  in  the  graph.  A  higher  post-bake         details along with your company logo
         temperature can be used, but this risks problems with      on publication@aipma.net       for printing
         blistering and warpage.
                                                                                 in the Directory.
         The alternative, as is the case in all of the materials we
         have discussed to this point, is to develop more structure
         in the part during the molding process by using a higher
         mold temperature. Figure 2 shows another result from
         Morrison's  study  that  makes  the  connection  between


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